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product structure : silicon monolithic integrated circuit this product is not designed to have protection against radioactive rays. 1/19 tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 3.feb.2016 rev.002 100ma fixed output for automotive ldo regulator bdxxfa1mg-m general description bdxxfa1mg-m is an ldo regulator with output current capabili ty of 0.1a and output voltage of 5.0v. the ssop5 package can contribute to the downsizing of the set. as protective function to prevent ic from destruction, this chip has built-in over current protection circuit to protect the dev ice when output is shorted and built-in t hermal shutdown circuit to protect the ic during thermal over load conditions. this regulator can use ceramic capacitor, which have smaller size and longer life than other capacitors. features ? aec-q100 qualified (note1) ? built-in high accuracy reference voltage circuit ? built-in over current protection circuit (ocp) ? built-in temperature protection circuit (tsd) ? zero a shutdown mode ? soft start function (note1 grade2) key features ? input power supply voltage range: vo+3.0v to 25.0v ? output voltage: 5.0v ? output current: 0.1a (max) ? shutdown current: 0 a (typ) ? operating temperature range: -40c to +105c typical application circuit package w(typ.) d(typ.) h(max.) ssop5 2.90mm x2.80mm x 1.25mm ordering information b d x x f a 1 m g - mtr part number output voltage 50:5.0v input voltage f:30v output current a1:0.1a m series package g:ssop5 product rank m:for automotive packaging specification tr: embossed tape and reel v o v cc en gnd c out c in c in , c out : ceramic capacitor downloaded from: http:///
2/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 block diagram bdxxfa1mg-m pin description pin no. pin name pin function 1 v cc input pin 2 gnd gnd pin 3 en enable pin 4 n.c. (note1) no connection (connect to gnd or leave open) 5 vo output pin (note 1) n.c. pin can be open since it is not connected inside of ic figure 1. block diagram vo n.c. vcc gnd en downloaded from: http:///
3/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 absolute maximum ratings (ta=-40c to +105c) parameter symbol limits unit power supply voltage v cc -0.3 to +30.0 (note1) v en voltage v en -0.3 to +30.0 v power dissipation ssop5 pd 332 (note2) mw operating temperature range topr -40 to +105 c storage temperature range tstg -55 to +150 c maximum junction temperature tjmax +150 c (note1) not to exceed pd. (mote2) in case ta R 25c (when mounted on a single-layer glass epoxy board with 114.3mm76.2mm1.57mm dimension) is reduced by 2.66mw/c recommended operating condi tions (ta=-40c to +105c) parameter symbol min. max. unit input power supply voltage v cc vo+3.0 25.0 v en voltage v en 0.0 25.0 v output voltage setting range v o 3.0 12.0 v output current i o 0.0 0.1 a recommended operating condition parameter symbol min. typ. max. unit conditions input capacitor c in 1.0 (note3) 2.2 - f ceramic capacitor recommended output capacitor c out 1.0 (note3) 2.2 - f ceramic capacitor recommended (note3) the minimum value of capacitor must meet this specification over full operating conditions. (ex: temperature, dc bias) electrical characteristics (unless otherwise sp ecified, vcc=10v, en=3v, ta=-40c to +105c) parameter symbol temp min. typ. max. unit conditions circuit current at shutdown mode i sd 25 - 0 5 a v en =0v, off mode -40 to +105 - - 5 bias current i cc 25 - 300 450 a -40 to +105 - - 500 line regulation reg.i 25 -1 +0.5 +1 % v cc =( vo+3v ) 25.0v -40 to +105 -1 +0.5 +1 load regulation reg i o 25 -1.5 +0.5 +1.5 % i o =0 0.1a -40 to +105 -1.5 +0.5 +1.5 minimum dropout voltage v co 25 - 2 3 v i o =0.1a -40 to +105 - - 3 output voltage vo 25 vo x 0.985 vo vo x 1.015 v i o =0.1a -40 to +105 vo x 0.98 vo vo x 1.02 en low voltage v en (low) 25 0 - 0.8 v -40 to +105 0 - 0.8 en high voltage v en (high) 25 2.4 - 25.0 v -40 to +105 2.4 - 25.0 en bias current i en 25 1 3 9 a -40 to +105 - - 9 downloaded from: http:///
4/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 thermal resistance (note 1) parameter symbol thermal resistance (typ) unit 1s (note 3) 2s2p ( note 4) ssop5 junction to ambient ja 376.5 185.4 c/w junction to top characterization parameter (note 2) jt 40 30 c/w (note 1) based on jesd51-2a(still-air) . (note 2) the thermal characterization parameter to report the difference between junction temperature and the temperature at the top cen ter of the outside surface of the component package. (note 3) using a pcb board based on jesd51-3. layer number of measurement board material board size single fr-4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and traces 70 m (note 4) using a pcb board based on jesd51-7. layer number of measurement board material board size thermal via (note 5) pitch diameter 4 layers fr-4 114.3mm x 76.2mm x 1.6mmt 1.20mm 0.30mm top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2mm 2 (square) 35 m 74.2mm 2 (square) 70 m (note 5) this thermal via connects with the copper pattern of all layers downloaded from: http:///
5/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 figure 2. input sequence (25c) (c out = 1 f) figure 5. input sequence (25c) (c out = 1 f) figure 3. input sequence (-40c) (c out = 1 f) figure 4. input sequence (105c) (c out = 1 f) performance curve (reference data) BD50FA1MG-M (unless otherwise specified, ta=25c, vcc=10v, en=3v, c in =c out =2.2 f) 40 s/div v en 2v/div vcc 5v/div vo 5v/div 40 s /div v cc 10v/div v en 2v/div vo 5v/div 40 s /div v en 2v/div vcc 5v/div vo 5v/div 40 s /div v en 2v/div vcc 5v/div vo 5v/div downloaded from: http:///
6/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 figure 8. transient response (25c) (io = 0a 0.1a) (c out = 1 f) figure 9. transient response (25c) (io = 0.1a 0a) (c out = 1 f) figure 6. input sequence (-40c) (c out = 1 f) figure 7. input sequence (105c) (c out = 1 f) performance curve (reference data) BD50FA1MG-M (unless otherwise specified, ta=25c, vcc=10v, en=3v, c in =c out =2.2 f) 4 s/div io 50ma/div vo 100mv/div 100 s/div io 50ma/div vo 100mv/div 40 s/div v cc 10v/div v en 2v/div vo 5v/div 40 s/div v cc 10v/div v en 2v/div vo 5v/div downloaded from: http:///
7/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 figure 10. transient response (-40c) (io = 0a 0.1a) (c out = 1 f) figure 11. transient response (-40c) (io = 0.1a 0a) (c out = 1 f) figure 12. transient response (105c) (io = 0a 0.1a) (c out = 1 f) figure 13. transient response (105c) (io = 0.1a 0a) (c out = 1 f) performance curve (reference data) BD50FA1MG-M (unless otherwise specified, ta=25c, vcc=10v, en=3v, c in =c out =2.2 f) 4 s /div io 50ma/div vo 100mv/div 100 s /div io 50ma/div vo 100mv/div 4 s /div io 50ma/div vo 100mv/div 100 s /div io 50ma/div vo 100mv/div downloaded from: http:///
8/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 figure 14. vcc - vo figure 15. ta - vo (io = 0ma) figure 16. ta - icc figure 17. ta-i sd (v en =0v) performance curve (reference data) BD50FA1MG-M (unless otherwise specified, ta=25c, vcc=10v, en=3v, c in =c out =2.2 f) temp=-40c temp =2 5 c tem p =105c downloaded from: http:///
9/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 figure 21. minimum dropout voltage figure 20. io - vo figure 19. io - icc figure 18. v cc -i sd (v en =0v) performance curve (reference data) BD50FA1MG-M (unless otherwise specified, ta=25c, vcc=10v, en=3v, c in =c out =2.2 f) temp=-40c temp=25c tem p =105c temp=-40c temp =2 5 c tem p =105c temp=-40c temp=25c tem p =105c temp =-4 0 c temp =2 5 c tem p =105c downloaded from: http:///
10/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 figure 22. tsd (io = 0ma) figure 24. psrr (io = 0ma) figure 23. ocp performance curve (reference data) BD50FA1MG-M (unless otherwise specified, ta=25c, vcc=10v, en=3v, c in =c out =2.2 f) temp =-4 0 c temp=25c tem p =105c temp=-40c temp=25c tem p =105c downloaded from: http:///
11/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 power dissipation ssop5 figure 25 ssop5 power dissipation data(reference) thermal design within this ic, the power consumption is decided by the dropout voltage condition, the load current and the circuit current. refer to power dissipation curves illustrated in figur e 25 when using the ic in an environment of ta 25 c. even if the ambient temperature ta is at 25 c, depending on the input voltage and the load current, chip junction temperature can be very high. consider the design to be tj tjmax = 150 c in all possible operating temperature range. should by any condition the maximum junction temperatur e tjmax = 150 c rating be exceeded by the temperature increase of the chip, it may result in deter ioration of the properties of the chip. t he thermal impedance in this specification is based on recommended pcb and measurement condition by jede c standard. verify the application and allow sufficient margins in the thermal design by the following met hod is used to calculate the junction temperature tj. tj can be calculated by either of the two following methods. 1. the following method is used to calculate the junction temperature tj. ? tj ta p c ja where: tj : junction temperature ta : ambient temperature p c : power consumption ja : thermal impedance (junction to ambient) 2. the following method is also used to calculate the junction temperature tj. tj t t p c jt where: tj : junction temperature t t : top center of cases (mold) temperature p c : power consumption jt : thermal impedance (junction to top center of case) ic mounted on rohm standard board based on jedec. board material: fr4 board size: 1s 114.3 mm x 76.2 mm x 1.57 mmt 2s2p 114.3 mm x 76.2 mm x 1.6 mmt mount condition: pcb and exposed pad are soldered. top copper foil: the footprint rohm recommend. + wiring to measure. p : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm x 0 mm) q : 4-layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2mm x 74.2 mm) condition p : ja = 376.5 c/w, jt =40 c/w condition q : ja = 185.4 c/w, jt =30 c/w 0.33 w 0.67 w 0.0 0.2 0.4 0.6 0.8 1.0 02 5 50 75 100 125 150 S?p? : pd[w] ta [?c] downloaded from: http:///
12/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 the following method is used to calculate the power consumption pc (w). pc vcc \ vo i o vcc ignd where: p c : power consumption vcc : input voltage vo : output voltage i o : load current ignd : circuit current ? calculation example (ssop5) if vcc = 8.0 v, vo = 5.0 v, i o = 50 ma, ignd = 400 a, the power consumption pc can be calculated as follows: p c vcc \ vo i o vcc ignd 8. v C . v ma 8. v a . w at the ambient temperature tamax = 105c, the thermal impedance (junction to ambient) ja = 185.4 c / w ( 4-layer pcb ), tj tamax p c ja c . w 8. c / w . c when operating the ic, the top center of cases (mold) temperature t t = 100 c jt = 40 c / w (1-layer pcb), tj t t p c jt c . w c / w . c for optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and thermal via between thermal land pad. downloaded from: http:///
13/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 0.01 0.1 1 10 0 2 04 06 08 01 0 0 equivalent ? series ? resistance: ? esr ? [ ] output ? current: ? io ? [ma] I input/output capacitor it is recommended that a capacitor is placed close to pin be tween input pin and gnd as well as output pin and gnd. the input capacitor becomes more necessary when the power suppl y impedance is high or when the pcb trace has significant length. moreover, the higher the capacit ance of the output capacitor the more stabl e the output will be, even with load and line voltage variations. however, please check the actual f unctionality by mounting on a boar d for the actual application. also, ceramic capacitors usuall y have different thermal and equivalent series resistance characteristics and may degrade gradually over continued use. for additional details, please check with the manufacturer and select the best ceramic capacitor for your application. output capacitor equivalent series resistance dc bias voltage [v] ceramic capacitor capacitance value D dc bias characteristics (characteristics example) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 01234 rated voltage: 10v b1 characteristics grm188b11a105ka61d rated voltage: 10v b characteristics rated volta g e: 6.3v b characteristics rated voltage: 4v x6s characteristics rated voltage: 10v f characteristics capacitance change [%] to prevent oscillation, please attach a capacitor between v o and gnd. generally, capacitor has esr (equivalent series resistance). operation will be stable in esr-io range shown in the right. the 2.2f ceramic capacitor and resistor at output in this characteristic data are connec ted in series and measured. generally, esr of ceramic capacitor, tantalum capacitor and electrolytic capacitor is different. check the esr of capacitor to be used and use it within the range of stable region. however, please take note that for the same value of capacitance of different electrolytic capacitor, esr are not always the same. in addition, esr characteristics may also change due to wiring impedance of board, input power impedance and load impedance; therefore check the behavior in actual application. stable area downloaded from: http:///
14/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 evaluation board circuit evaluation board parts list board layout ? input capacitor c in connected to v cc should be placed as close as possible to v cc pin and use wide layout. output capacitor c out should also be placed as close as possible to ic pin. in case connected to inner layer gnd plane, please use several through hole. ? please make gnd pattern wide enough to handle the power dissipation of the chip. designation value part no. company designation value part no. company r1 \ \ c4 \ \ \ r2 \ \ c5 2.2f cga4j1x7r1v225m tdk r3 \ \ \ c6 r4 \ \ \ c7 \ \ \ r5 \ \ \ c8 \ \ \ r6 \ \ \ c9 \ \ \ c1 2.2f cga4j1x7r1v225m tdk c10 \ \ \ c2 \ \ u1 \ BD50FA1MG-M rohm c3 \ \ u2 \ \ \ gnd n.c v o v o c7 4 2 1 c1 c2 c3 5 v cc 3 en gnd sw1 en c6 c5 vcc v o en gnd v cc c in c out downloaded from: http:///
15/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 operational notes 1. reverse ? connection ? of ? power ? supply ? connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power ? supply ? lines ? design the pcb layout pattern to provide low impedance s upply lines. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperatur e and aging on the capacitance value when using electrolytic capacitors. 3. ground ? voltage ? ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal ? consideration ? should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding th is absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. recommended ? operating ? conditions ? these conditions represent a range within which the ex pected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush ? current ? when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consi deration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation ? under ? strong ? electromagnetic ? field ? operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing ? on ? application ? boards ? when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter \ pin ? short ? and ? mounting ? errors ? ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused ? input ? pins ? input pins of an ic are often connec ted to the gate of a mos transistor. th e gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a si gnificant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
16/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 operational notes C continued 12. regarding ? the ? input ? pin ? of ? the ? ic ? this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic . the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure xx. example of monolithic ic structure 13. ceramic ? capacitor ? when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area ? of ? safe ? operation ? (aso) ? operate the ic such that the output voltage, output curren t, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceed s the absolute maximum rati ngs and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 16. over ? current ? protection ? circuit ? (ocp) ? this ic incorporates an integrated overcu rrent protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 17. disturbance ? light ?? in a device where a portion of silicon is exposed to light such as in a wl-csp, ic characteristics may be affected due to photoelectric effect. for this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. downloaded from: http:///
17/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 marking diagram marking ssop5(top view) lot number x x xx output voltage marking 50 5.0v typ. xz downloaded from: http:///
18/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 physical dimension tape and reel information package name ssop5 downloaded from: http:///
19/19 bdxxfa1mg-m datasheet tsz02201-0geg0a600050-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3.feb.2016 rev.002 revision history date revision re vision contents 11.nov.2015 001 new release 3.feb.2016 002 p3 output voltage limit modified all input voltage symbol changed into vcc all output voltage symbol changed into vo downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with th e rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contain ed in this document are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take p roper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified , reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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